Semin

Repairs joints, cracks and holes on plaster, concrete and brick in one application. Smooth finish ready to paint, with minimal sanding required.

Removes all types of wallpaper (vinyl, thick, special) in just a few minutes. 90% biodegradable, rapid dilution in warm or cold water for easy removal with a scraper.

Ready-to-use joint filler for plasterboard seams with tape and wall/concrete finishing. Easy smoothing, effortless sanding, enhanced adhesion, no shrinkage.

Ready-to-use adhesive for fibreglass in interior spaces. Odour-free and non-dilutable, applies easily with optimal coverage.

Ready-to-use filler for filling, smoothing and bonding joint tape on all substrates. Excellent slip, no shrinkage, mechanical application possible and easy sanding.

Joint filler for plasterboard with 24-hour working time. Ideal for large projects thanks to its extended workability and manual or mechanical application.

Fills holes and cracks on all surfaces in a flash. Dries quickly, sands effortlessly and guarantees a smooth, paint-ready finish.

Joints and smooths plasterboard with a setting time of just 4 hours. Immediate finish without sanding, ideal for rapid project completion.

Adhesive primer for new or old concrete substrates. Improves paint adhesion and reduces surface porosity.

Water-based ready-to-use primer that blocks moisture on interior and exterior walls. Prepares damp surfaces for plaster and paint finishes.

Fills and smooths your walls in a single airless application up to 4 mm thick. White matt finish, odourless, ready to paint.

Ready-to-use smoothing compound for levelling interior walls and ceilings in plaster or concrete. Controlled dust formula for healthier sanding and a cleaner worksite.

Fills cracks and joints indoors and outdoors without mesh tape thanks to its glass fibres. Follows substrate deformations without cracking.

Fills cracks and holes in interior walls and ceilings without shrinkage. Ultra-light paste, fast drying and remains flexible to absorb micro-movements of the substrate.